| 摘要 |
<P>PROBLEM TO BE SOLVED: To interconnect a plurality of conductive members to be connected in free shape by a simple process in a conductive connection structure. <P>SOLUTION: In a conductive connection structure 2, a plurality of conductive members to be connected 31, 32 are connected via a conductive connection film 1. The conductive connection structure 2 includes, as the conductive connection film 1, an uncured or semi-cured curable resin film 11, and a conductive pattern 21 formed on at least one surface of the curable resin film 11 and having a conductive connection 21C being connected with the plurality of conductive members to be connected 31, 32. At least the connection side surface of the conductive connection 21C is exposed in the conductive pattern 21, and the conductive connection film 1 is cured and shaped during conductive connection thus performing conductive connection of the plurality of conductive members to be connected 31, 32. <P>COPYRIGHT: (C)2012,JPO&INPIT |
