| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition excellent in self-filleting properties and excellent also in bleeding resistance in an underfill material for a flip chip type semiconductor device. <P>SOLUTION: The liquid sealing resin composition used for a flip chip type semiconductor device contains: (A) a liquid epoxy resin; (B) an aromatic amine; (C) an inorganic filler; (D) a liquid silicone compound having a polyether group; and (E) a liquid silicone compound having an amino group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
