| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card substrate and an IC card using the same with which the mold crack or IC chip crack due to bending of an IC Card or peeling of an IC module can be prevented by providing an appropriate groove. <P>SOLUTION: External terminals C1 to C8 provided on the surface of an IC card substrate 3 are insulated by using an insulating groove. At the rear side of the IC card substrate and at the inside of the outside terminal, there is mounted an IC chip. When the IC chip is protected by a mold, the insulating groove is formed along the outer periphery of the IC chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
