| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device. <P>SOLUTION: A method for manufacturing a semiconductor device includes a step for providing a semiconductor die having a plurality of bumps formed on an active surface of the semiconductor die; a step for providing a substrate; a step for forming a plurality of conductive traces having an interconnection portion on the substrate, the bumps being wider than the interconnection portion; a step for forming a masking layer on a region of the substrate away from the interconnection portion; a step for adhering the bumps to the interconnection portion so that the bumps cover a top face and a side face of the interconnection portion; and a step for accumulating a sealing material around the bumps between the semiconductor die and the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
