发明名称 ADHESIVE RESIN COMPOSITION AND MOLDED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive film capable of simply, easily and tightly bonding various adherends. <P>SOLUTION: The adhesive resin composition includes, as the essential components: 100 pts.wt. of a base resin mainly comprising 10-90 pts.wt. of a modified styrenic thermoplastic elastomer (A) and 90-10 pts.wt. of a polyolefin resin (B), wherein (A)+(B)=100 (pts.wt.); and (E) 1-100 pts.wt. of a tackifier. The modified styrenic thermoplastic elastomer (A) configuring the base resin is made by carrying out modification through a step of melt-kneading a styrenic thermoplastic elastomer, a polar group-containing vinyl monomer (C) and an aromatic vinyl monomer (D), in the presence of a radical polymerization initiator (F). In the melt-kneading step, modification is carried out by adding, to 100 pts.wt. of the styrenic thermoplastic elastomer: 0.1-15 pts.wt. of the polar group-containing vinyl monomer (C); 0.1-15 of the aromatic vinyl monomer (D); and 0.01-5 pts.wt. of the radical polymerization initiator (F). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012107115(A) 申请公布日期 2012.06.07
申请号 JP20100256517 申请日期 2010.11.17
申请人 KANEKA CORP 发明人 MICHINOBU TAKAO;OKADA YASUNORI
分类号 C09J125/08;C08F279/02;C09J11/08;C09J123/00;C09J123/10;C09J153/02 主分类号 C09J125/08
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