| 发明名称 |
IMPROVED ADHESIVE FILM LAYER FOR PRINTED CIRCUIT BOARD APPLICATIONS |
| 摘要 |
One or more embodiments contained herein disclose an adhesive layer for printed circuit board (PCB) applications. The improved adhesive film layer may comprise a benzoxazine resin and a phenoxy resin. According to some embodiments, the improved adhesive film layer may be coated onto a polyester release sheet. |
| 申请公布号 |
WO2012075344(A2) |
申请公布日期 |
2012.06.07 |
| 申请号 |
WO2011US62969 |
申请日期 |
2011.12.01 |
| 申请人 |
INTEGRAL TECHNOLOGY, INC.;HUNRATH, CHRISTOPHER, A. |
发明人 |
HUNRATH, CHRISTOPHER, A. |
| 分类号 |
C09J179/00 |
主分类号 |
C09J179/00 |
| 代理机构 |
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