发明名称 |
ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING |
摘要 |
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from electrical charge build-up on the microelectronic devices during the formation of through-silicon vias. |
申请公布号 |
WO2012037509(A3) |
申请公布日期 |
2012.06.07 |
申请号 |
WO2011US52016 |
申请日期 |
2011.09.16 |
申请人 |
INTEL CORPORATION;LEE, KEVIN, J. |
发明人 |
LEE, KEVIN, J. |
分类号 |
C09J9/02;C09J5/00;C09J11/00;C09J201/00;H05K3/30 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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