发明名称 |
An insulating resin composition for multilayer wiring board and a multilayer wiring board comprising the same |
摘要 |
PURPOSE: An insulative resin composition is provided to have excellent mechanical properties and reliability. CONSTITUTION: An insulative resin composition comprises a polymer resin, and graphene oxide dispersed into a cured material of the polymer resin. A multilayered wiring board comprises a board main body in which a plurality of insulating layers(11,12,13) are laminated; and a circuit pattern(21) formed on the insulative layers. At least one layer of the insulative layers consists of an insulative resin composition comprising graphene oxide dispersed inside the polymer resin and the cured material of the polymer resin.
|
申请公布号 |
KR20120058127(A) |
申请公布日期 |
2012.06.07 |
申请号 |
KR20100119775 |
申请日期 |
2010.11.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SHIM, JI HYE;LEE, KYU SANG;JI, SOO YOUNG |
分类号 |
H01B3/40;H01B3/12;H01L21/08 |
主分类号 |
H01B3/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|