| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser dicing method that controls the occurrence of cracks and implements superior division characteristics by optimizing the irradiation conditions of a pulsed laser beam. <P>SOLUTION: In the laser dicing method, a substrate to be worked is placed on a stage, a clock signal is generated, a pulsed laser beam synchronized with the clock signal is emitted, the substrate to be worked and the pulsed laser beam are moved relatively, irradiation and non-irradiation of the pulsed laser beam to the substrate to be worked are switched in light pulse unit by controlling passing and blocking of the pulsed laser beam using a pulse picker in synchronization with the clock signal, and thus cracks that reach the substrate surface are formed in the substrate to be worked. By controlling the irradiation energy of the pulsed laser beam, the work point depth of the pulsed laser beam, and the interval of the irradiation and non-irradiation of the pulsed laser beam, the cracks are formed so as to be continuous on the surface of the substrate to be worked. <P>COPYRIGHT: (C)2012,JPO&INPIT |
