| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, which is superior relating to tackiness of a layer of the photosensitive resin composition, gives a cured film with excellent flame retardancy after cured, exhibits high resolution and is alkali-developable, and to provide a photosensitive element using the composition. <P>SOLUTION: The photosensitive resin composition contains: (A) a polyimide precursor having a weight average molecular weight of 10,000 to 150,000; (B) a polyurethane resin; (C) a phosphorus-containing compound; (D) a photopolymerizable compound having at least one ethylenically unsaturated group in the molecule; and (E) a photopolymerization initiator. The (A) polyimide precursor is a specified polyimide precursor represented by general formula (1); and the (B) polyurethane resin contains a specified polyurethane resin expressed by general formula (2), which is a reaction product of an epoxy acrylate compound having an ethylenically unsaturated group and two or more hydroxyl groups, a diisocyanate compound and a diol compound having a carboxyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
