| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating apparatus in which the posture of a substrate holder can be changed from a horizontal state to a vertical state or from a vertical state to a horizontal state without using any large-scale complicated rotating mechanism, to provide a plating method, and to provide a method for changing the posture of a substrate holder for a plating apparatus. <P>SOLUTION: The plating apparatus has a table 120 for horizontally mounting a substrate holder 110 which attachably and detachably holds the substrate, a plating part 130, a holding part which holds the substrate holder, and a substrate holder conveying part 140 for conveying the substrate holder between the table and the plating part, wherein the table supports one end of the substrate holder and has a horizontal movement mechanism 121 which is movable in the horizontal direction, and the substrate holder conveying part has a raising and lowering mechanism which changes the substrate holder from a vertical state to a horizontal state or from a horizontal state to a vertical state in conjunction with the horizontal direction movement of the horizontal movement mechanism caused by raising or lowering the holding part in a state that the other end of the substrate holder is supported on the horizontal movement mechanism. <P>COPYRIGHT: (C)2012,JPO&INPIT |
