| 发明名称 |
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE |
| 摘要 |
An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C.
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| 申请公布号 |
US2012141786(A1) |
申请公布日期 |
2012.06.07 |
| 申请号 |
US201113272550 |
申请日期 |
2011.10.13 |
| 申请人 |
UH DONG SEON;SONG GYU SEOK;HWANG MIN KYU;SONG KI TAE;SEO DAE HO |
发明人 |
UH DONG SEON;SONG GYU SEOK;HWANG MIN KYU;SONG KI TAE;SEO DAE HO |
| 分类号 |
B32B27/38;B32B7/12;C08F210/00;C08G18/00;C08G69/00 |
主分类号 |
B32B27/38 |
| 代理机构 |
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