发明名称 OPTICAL COMMUNICATION MODULE
摘要 It is expected to provide an optical communication module that does not require making a conductive plate, such as a leadframe, become thinner in response to the downsizing of the photoelectric conversion device, such as a laser diode or a photodiode, and does not require downsizing a lens. A laser diode is connected and fixed to a conductive plate on the top surface of a transparent light-passing board. The light-passing board is connected and fixed to a conductive plate on the top surface of a transparent base. A first lens and a second lens are integrally formed on the top and the bottom surfaces of the base, respectively. The laser diode performs transmission of optical signals through the gap of conductive plate, the transparent light-passing board, the opening portion of a conductive plate, the opening portion of conductive plate, the first lens, the transparent base and the second lens.
申请公布号 US2012141143(A1) 申请公布日期 2012.06.07
申请号 US201013390192 申请日期 2010.07.13
申请人 HAYASHI SHIGEO;TAKAGI TOSHIO;AUTONETWORKS TECHNOLOGIES, LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO WIRING SYSTEMS, LTD. 发明人 HAYASHI SHIGEO;TAKAGI TOSHIO
分类号 H04B10/04 主分类号 H04B10/04
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