| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable substrate for a power module capable of solving a warpage problem. <P>SOLUTION: The substrate for power module is manufactured using processes of: bonding a ceramic substrate 20 with a metal plate 50 having a prescribed thickness by laminating alternately; and then, by cutting the metal plate 50 at a halfway position of the thickness direction along the surface direction, forming a first metal layer 30 and a second metal layer 40 of prescribed thicknesses respectively on both surfaces of the ceramic substrate 20. The thickness of the first metal layer 30 and the thickness of the second metal layer 40 can be different. <P>COPYRIGHT: (C)2012,JPO&INPIT |
