EDGE POLISHING APPARATUS FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an edge polishing apparatus for obtaining a semiconductor substrate with a protective film which does not shorten the life of a rear face grinding stone of the semiconductor substrate.

SOLUTION: An edge polishing apparatus 1 comprises a polishing head 4 which has a cam-like frame 4b pivotally supported by a rotation axis 4a; a stop pin 4c; a patch 4d made of silicone rubber sponge for contacting the edge part of a semiconductor substrate with a polishing surface of a polishing tape T and sliding a polishing tape supplied from a supply reel 2 on its surface; a pair of first polishing tape feeding roller 4e provided apart across the patch and a second polishing tape feeding roller 4f; and a third polishing tape feeding roller 4g provided on a back surface of the first engineering polishing tape feeding roller made of resin and for returning the polishing tape to the take-up reel 3.

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