发明名称 |
Techniques for Forming Solder Bump Interconnects |
摘要 |
Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer. |
申请公布号 |
US2012138769(A1) |
申请公布日期 |
2012.06.07 |
申请号 |
US201213371840 |
申请日期 |
2012.02.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANG BING;GRUBER PETER A.;GUERIN LUC;PATEL CHIRAG S. |
分类号 |
B22C9/22 |
主分类号 |
B22C9/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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