发明名称 Method for Manufacturing a High-functional Pad Conditioner for Chemical Mechanical Planarization and High-functional Pad Conditioner produced thereby
摘要 PURPOSE: A manufacturing method of a high-functional conditioner for a CMP(chemical mechanical planarization) pad and a high-functional conditioner manufactured thereby are provided to properly process the shape of a cutting tip formed on the conditioner depending on the kind of a pad or slurry. CONSTITUTION: A manufacturing method of a high-functional conditioner for a CMP pad is as follows. A substrate is prepared. Multiple column or pyramid-shaped protruded parts are formed on a part or the whole of one surface of the substrate through laser processing to be separated from each other. A plane parallel to the surface of the substrate is formed on the top ends of the protruded parts. The surface of the substrate having the protruded parts is coated with a diamond layer.
申请公布号 KR20120058303(A) 申请公布日期 2012.06.07
申请号 KR20100120020 申请日期 2010.11.29
申请人 EHWA DIAMOND IND. CO., LTD. 发明人 YOON, SO YOUNG;KIM, YOUN CHUL;LEE, JOO HAN;LEE, JONG JAE
分类号 B24B53/12;H01L21/304 主分类号 B24B53/12
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