发明名称 |
SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING |
摘要 |
A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W. |
申请公布号 |
US2012139099(A1) |
申请公布日期 |
2012.06.07 |
申请号 |
US201113311235 |
申请日期 |
2011.12.05 |
申请人 |
LOPEZ NOEL A.;LYONS MICHAEL R.;LAIDIG DAVE;BUER KENNETH V.;VIASAT, INC. |
发明人 |
LOPEZ NOEL A.;LYONS MICHAEL R.;LAIDIG DAVE;BUER KENNETH V. |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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