<p>An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.</p>
申请公布号
WO2012074638(A1)
申请公布日期
2012.06.07
申请号
WO2011US58039
申请日期
2011.10.27
申请人
ELECTRO SCIENTIFIC INDUSTRIES, INC.;KOSMOWSKI, MARK, T.;ALPAY, MEHMET