发明名称 PLATING STRUCTURE AND COATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plating structure having a surface that is not sulfurized and damaged by passage of time or temperature rise, and to provide a method for coating an electric component, whereby a coating material for the electric component that is hardly discolored by sulfuration and has small contact resistance can be obtained. <P>SOLUTION: The plating structure is obtained by heat-treating a silver-plated structure that is produced by forming a plated silver layer 104 on a surface of a substrate 102 to be plated and further forming a plating layer 106 of an Sn-Co alloy on a surface of the plated silver layer. The coating method comprises: forming particle deposits that are obtained by arranging sparsely deposited particles of the Sn-Co alloy, which are deposited like dots on the surface of the silver layer formed on the face of the substrate by a particle deposition process, so as to have spaces among the sparsely deposited particles without making them overlap in a direction vertical to the surface when viewed from the above; and heating the particle deposits in a non-oxidizing atmosphere, thereby melting the sparsely deposited particles to form a coating film. Here, the average diameter of the sparsely deposited particles is 20-80 nm, and the weight of the sparsely deposited particles of the tin alloy on the surface of the silver layer per unit area is from 2&times;10<SP POS="POST">-6</SP>to 8&times;10<SP POS="POST">-6</SP>g/cm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012107263(A) 申请公布日期 2012.06.07
申请号 JP20100254605 申请日期 2010.11.15
申请人 KYOWA DENSEN KK 发明人 SUMITANI YOSHINORI;SUGIE KINYA
分类号 C25D7/00;C25D5/10;C25D5/50;H01H1/04;H01H11/04;H01L33/60 主分类号 C25D7/00
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