| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to enhance process efficiency by extending leads of the lowermost semiconductor package and bending the leads to the upper side and simplifying connection between the leads. CONSTITUTION: A first semiconductor package(100) comprises a first lead frame(110), a first semiconductor chip(120), a first wire(130), and a first molding unit(140). The first lead frame comprises a first die paddle(112), first leads(114), and lead connectors(116). The first semiconductor chip is mounted on the first die paddle of the first lead frame. A second semiconductor package(200) comprises a second lead frame(210), a second semiconductor chip(220), a second wire(230), and a second molding unit(240). A third semiconductor package(300) comprises a third lead frame(310), a third semiconductor chip(320), a third wire(330), and a third molding unit(340).</p> |
