| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems that when a semiconductor element is mounted on a circuit board by using flip chip mounting technique, a joining part between the semiconductor element and the circuit board is not visible and the joining quality is not directly determined, and previously proposed inspection methods are not suitable for determining fine joining states of semiconductor elements mounted by using the flip chip mounting technique. <P>SOLUTION: An LED device 10, in which an LED element 20 is mounted on a circuit board by using flip chip mounting technique, includes a negative electrode 17 and a positive electrode 16. A forward voltage is measured between the positive electrode 16 and the negative electrode 17. Next, only the negative electrode 17 is heated by a heater 25, and the forward voltage is measured again. Finally, the occurence of the connection failure is determined based on measurement values before and after heating. <P>COPYRIGHT: (C)2012,JPO&INPIT |
