发明名称 Structure and Method for Topography Free SOI Integration
摘要 A semiconductor structure is provided that includes a semiconductor oxide layer having features. The semiconductor oxide layer having the features is located between an active semiconductor layer and a handle substrate. The semiconductor structure includes a planarized top surface of the active semiconductor layer such that the semiconductor oxide layer is beneath the planarized top surface. The features within the semiconductor oxide layer are mated with a surface of the active semiconductor layer.
申请公布号 US2012139085(A1) 申请公布日期 2012.06.07
申请号 US20100958429 申请日期 2010.12.02
申请人 TODI RAVI M.;ERVIN JOSEPH;PEI CHENGWEN;WANG GENG;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 TODI RAVI M.;ERVIN JOSEPH;PEI CHENGWEN;WANG GENG
分类号 H01L29/38;H01L21/3213 主分类号 H01L29/38
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