HEAT-CURING RESIN COMPOSITION, HEAT-CURING ADHESIVE SHEET, AND METHOD FOR PRODUCING HEAT-CURING ADHESIVE SHEET

摘要

Provided is a heat-curing resin composition having favorable seepage properties for unreacted epoxy resin and the like at the time of heat-pressure molding, without ultraviolet irradiation or the like. The heat-curing resin composition contains: an acrylic copolymer containing a (meth) acrylic acid ester monomer that contains an epoxy group; an epoxy resin, and a curing agent for the epoxy resin. The curing agent contains an organic acid dihydrazide. The epoxy group section of the acrylic copolymer is partially cross-linked via a liquid polyamine or polyamideamine having at least one of either a primary amino group or a secondary amino group.