发明名称 |
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING |
摘要 |
A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a poly-hydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide. |
申请公布号 |
EP2459779(A1) |
申请公布日期 |
2012.06.06 |
申请号 |
EP20100734120 |
申请日期 |
2010.07.19 |
申请人 |
BASF SE |
发明人 |
ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;MAYER, DIETER;HAAG, ALEXANDRA;EMNET, CHARLOTTE |
分类号 |
C25D3/38;C25D3/40;H01L21/288;H01L21/768 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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