Flip-Chip-Anordnung aufweisend ein Array von Vertikalkavitäts-Oberflächen-emittierenden Lasern (VCSELs)

摘要

A known flip-chip assembly manufacturing process is augmented by process steps of the invention to create a VCSEL flip-chip assembly comprising a plurality of semiconductor devices having respective arrays of a small number of VCSELs thereon, which are mounted on a substrate to form a large array of VCSELs that are precisely optically aligned with their respective optical coupling elements.