发明名称 |
MULTILAYER PRINTED WIRING BOARD |
摘要 |
<p>An object of the present invention is to provide a multilayer printed circuit board where there is greater freedom in design, miniaturization can be achieved, and furthermore, a circuit with high density can be easily handled. A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.</p> |
申请公布号 |
EP1811823(B1) |
申请公布日期 |
2012.06.06 |
申请号 |
EP20050790482 |
申请日期 |
2005.10.04 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ASAI, MOTOO;KODAMA, HIROAKI;YAMADA, KAZUHITO |
分类号 |
G02B6/43;G02B6/00;G02B6/122;G02B6/42;H05K1/02;H05K3/46 |
主分类号 |
G02B6/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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