发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat insulation sheet capable of well suppressing or delaying the heat generated at one member such as an electronic component from being transmitted to the other member such as a case incorporating the electronic component, as well as a case which utilizes the heat insulation sheet, by utilizing a latent heat micro capsule including a latent heat storing material having no foaming characteristics. <P>SOLUTION: The heat insulation sheet 1 is constituted by packing a base material 3 of silicone rubber with a latent heat micro capsule 5 including paraffin and a foaming micro capsule 7, not foamed yet but having foaming characteristics (A). When an electronic component arranged on one side of the heat insulation sheet 1 overheats, the foaming micro capsule 7 foams to exhibit heat insulation characteristics as in (B), while the heat passing through the base material 3 is absorbed into the latent heat micro capsule 5 as latent heat. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP4947428(B2) 申请公布日期 2012.06.06
申请号 JP20070293416 申请日期 2007.11.12
申请人 发明人
分类号 H05K7/20;B32B5/20;B32B25/02;C08J9/32;C08K7/16;C08L83/04;C08L91/00;C09K5/06 主分类号 H05K7/20
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