| 摘要 |
<p>The card (10) has a module (14) having a microcircuit (16) and a body (12) including a cavity (28) for receiving the module, where the cavity defines a surface area for fastening the module in the cavity. The body is formed by a stack of a weak adhesion layer (40) and strong adhesion layers (42A, 42B) respectively presenting weak adhesion and strong adhesion with the module, where the area extends in the weak adhesion layer and includes a hole leading to the strong adhesion layers so as to directly form an anchor point for the module with the strong adhesion layers. An independent claim is also included for a method for fabricating a smart card.</p> |
