| 摘要 |
An electronic paper display, in particular for an electronic shelf label, comprises an electronic paper panel 110, a substrate 120 and a driving IC chip 140 bonded to the substrate. The driving chip is preferably bonded to a first surface of a packaging unit 150. In one embodiment a recess 121 is provided in the substrate to accommodate the driving IC and the first surface of the packaging unit is bonded to the substrate, wirings (Fig. 5) being provided on the first surface of the packaging unit to connect the driving IC to the electronic paper panel. Alternatively (Fig. 1) a second surface of the packaging unit is bonded to the substrate and both surfaces of the packaging unit are provided with wirings. An additional driving IC may be bonded to an opposite surface of the substrate. The packaging unit may have a triangular (151, Fig. 8B) or semi-circular shape. A method for manufacturing the electronic paper display comprises the steps of manufacturing a substrate and bonding an electronic paper panel and a driving IC to the substrate. The driving IC is preferably attached to a packaging unit. A hole 121 may be formed in the substrate to accommodate the driving IC. The electronic paper display may be manufactured by a simplified process and can reduce product costs by using more inexpensive components. |
