发明名称 |
ADHESIVE-FREE FLEXIBLE LAMINATE |
摘要 |
<p>Provided is a non-adhesive flexible laminate comprising a polyimide film at least one surface of which has been plasma-treated, a tie-coat layer formed on the plasma-treated surface, a metal seed layer formed on the tie-coat layer, and a metal conductor layer formed on the metal seed layer, wherein a ratio Á p /Á t of actual density Á p to theoretical density Á t of the tie-coat layer satisfies Á p /Á t > 0.6. The invention aims to improve the adhesion between the metal layer and the polyimide film of the non-adhesive flexible laminate (in particular a two-layered metalizing laminate).</p> |
申请公布号 |
EP2241436(A4) |
申请公布日期 |
2012.06.06 |
申请号 |
EP20080872091 |
申请日期 |
2008.12.25 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
MAKINO, NOBUHITO;HOKURA, AKITO;INAZUMI, HAJIME |
分类号 |
B32B15/088;B32B15/08;C23C28/02;H05K1/03 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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