| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To mount a semiconductor on a first metal plate without using a positioning tool, in a manufacturing method of a semiconductor device wherein a wire is connected to one surface of a semiconductor element, and a first metal plate and a second metal plate are solder-jointed to the other surface and the one surface of the semiconductor element by a once reflow process. <P>SOLUTION: Guide wires 200 each having a shape extending along the outline of an element mounting region R are previously arranged outside of the element mounting region R being a region for mounting a semiconductor element 10 therein within one surface 31 of a first metal plate 30; and first solder 50, the semiconductor element 10 and second solder 60 are sequentially mounted on the one surface 31 of the first metal plate 30 by using the guide wires 200 as positioning marks. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
