| 发明名称 |
Composition and method for improved adhesion of polymeric materials to copper alloy surfaces |
| 摘要 |
The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board. |
| 申请公布号 |
US8192636(B2) |
申请公布日期 |
2012.06.05 |
| 申请号 |
US20060090990 |
申请日期 |
2006.10.23 |
| 申请人 |
TEWS DIRK;SPARING CHRISTIAN;ATOTECH DEUTSCHLAND GMBH |
发明人 |
TEWS DIRK;SPARING CHRISTIAN |
| 分类号 |
H01L21/306;C09K13/00 |
主分类号 |
H01L21/306 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
