发明名称 |
Electronic component and method of manufacturing same |
摘要 |
An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction. |
申请公布号 |
US8193894(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20100752875 |
申请日期 |
2010.04.01 |
申请人 |
MIYOSHI HIROMI;INUI MASAKI;TOKUDA HIROMICHI;MURATA MANUFACTURING CO., LTD. |
发明人 |
MIYOSHI HIROMI;INUI MASAKI;TOKUDA HIROMICHI |
分类号 |
H01F5/00;H01F7/06;H01F27/28 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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