| 发明名称 |
Semiconductor chip with reinforcing through-silicon-vias |
| 摘要 |
A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side. |
| 申请公布号 |
US8193039(B2) |
申请公布日期 |
2012.06.05 |
| 申请号 |
US20100889615 |
申请日期 |
2010.09.24 |
| 申请人 |
SU MICHAEL Z.;REFAI-AHMED GAMAL;BLACK BRYAN;ADVANCED MICRO DEVICES, INC.;ATI TECHNOLOGIES ULC |
发明人 |
SU MICHAEL Z.;REFAI-AHMED GAMAL;BLACK BRYAN |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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