发明名称 Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device
摘要 A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.
申请公布号 US8193614(B2) 申请公布日期 2012.06.05
申请号 US20080053903 申请日期 2008.03.24
申请人 YAMADA TOMOYUKI;USHIDA FUMIO;TAKEDA SHIGETOSHI;AWAYA TOMOHARU;BANNO KOJI;MINAMI TAKAYOSHI;FUJITSU SEMICONDUCTOR LIMITED 发明人 YAMADA TOMOYUKI;USHIDA FUMIO;TAKEDA SHIGETOSHI;AWAYA TOMOHARU;BANNO KOJI;MINAMI TAKAYOSHI
分类号 H01L23/544;H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/544
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