发明名称 |
Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device |
摘要 |
A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer. |
申请公布号 |
US8193614(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20080053903 |
申请日期 |
2008.03.24 |
申请人 |
YAMADA TOMOYUKI;USHIDA FUMIO;TAKEDA SHIGETOSHI;AWAYA TOMOHARU;BANNO KOJI;MINAMI TAKAYOSHI;FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
YAMADA TOMOYUKI;USHIDA FUMIO;TAKEDA SHIGETOSHI;AWAYA TOMOHARU;BANNO KOJI;MINAMI TAKAYOSHI |
分类号 |
H01L23/544;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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