发明名称 Backlight module with a heat conductive block
摘要 A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.
申请公布号 US8194208(B2) 申请公布日期 2012.06.05
申请号 US20100881145 申请日期 2010.09.13
申请人 WU MENG-CHAI;LO CHI-CHUNG;HSIEH CHIN-KUN;LAI CHENG-CHIH;CHENG CHI-CHEN;AU OPTRONICS CORP. 发明人 WU MENG-CHAI;LO CHI-CHUNG;HSIEH CHIN-KUN;LAI CHENG-CHIH;CHENG CHI-CHEN
分类号 G02F1/1333;F21V7/04;G02F1/1335 主分类号 G02F1/1333
代理机构 代理人
主权项
地址
您可能感兴趣的专利