发明名称 |
Backlight module with a heat conductive block |
摘要 |
A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel. |
申请公布号 |
US8194208(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20100881145 |
申请日期 |
2010.09.13 |
申请人 |
WU MENG-CHAI;LO CHI-CHUNG;HSIEH CHIN-KUN;LAI CHENG-CHIH;CHENG CHI-CHEN;AU OPTRONICS CORP. |
发明人 |
WU MENG-CHAI;LO CHI-CHUNG;HSIEH CHIN-KUN;LAI CHENG-CHIH;CHENG CHI-CHEN |
分类号 |
G02F1/1333;F21V7/04;G02F1/1335 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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