发明名称 |
Probe polishing method, program therefor, and probe apparatus |
摘要 |
A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from a first receiving part. The probe polishing method includes transferring the polishing member from the first receiving part to the mounting table; detecting a presence of foreign materials on a top surface of the polishing member mounted on the mounting table; transferring the polishing member from the mounting table to a second receiving part when the foreign materials are detected on the top surface of the polishing member; removing the foreign materials from the polishing member in the second receiving part; and transferring the polishing member from which the foreign materials are removed from the second receiving part to the first receiving part. |
申请公布号 |
US8195324(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20090545184 |
申请日期 |
2009.08.21 |
申请人 |
TANAKA HIDEAKI;SANO SATOSHI;TOKYO ELECTRON LIMITED |
发明人 |
TANAKA HIDEAKI;SANO SATOSHI |
分类号 |
B24B51/00;G06F11/30;G06F19/00 |
主分类号 |
B24B51/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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