发明名称 |
Method for bonding layers, corresponding device and organic light-emitting diode |
摘要 |
A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers comprising a semiconductor material, as well as to a correspondingly manufactured device. Also disclosed is a method for manufacturing an organic light-emitting diode and an organic light-emitting diode that is encapsulated between two cover layers with the aid of thermocompression. |
申请公布号 |
US8193070(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20060992992 |
申请日期 |
2006.09.22 |
申请人 |
GROLIER VINCENT;PLOESSL ANDREAS;RENNER MARIANNE;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
GROLIER VINCENT;PLOESSL ANDREAS;RENNER MARIANNE |
分类号 |
H01L21/30;H01L29/06 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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