发明名称 |
Semiconductor light emitting device of junction-down type and semiconductor light emitting element of junction-down type |
摘要 |
In a semiconductor light emitting device of junction-down type, a semiconductor light emitting element having a stripe part is provided with a bonding part for die bonding in a part of a surface thereof where the stripe part is formed, the bonding part being at a position away from the stripe part, and being junction-down bonded onto an electrode pattern on a holding substrate.
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申请公布号 |
US8193552(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20090320841 |
申请日期 |
2009.02.05 |
申请人 |
ISHIDA YUJI;ROHM CO., LTD. |
发明人 |
ISHIDA YUJI |
分类号 |
H01L33/00;H01S5/022;H01S5/343 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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