| 摘要 |
PURPOSE: A semiconductor chip package is provided to increase thermal performance by broadening a surface area of a heat sink since a roughness portion is formed on an outer surface of the heat sink. CONSTITUTION: A plurality of balls(115) is formed at a lower portion of a substrate(110). A plurality of bumps(125) electrically connects a semiconductor chip(120) with the substrate. A thermal conductive material(150) is provided between a heat sink(140) and the semiconductor chip. A top outer surface of the heat sink includes a roughness portion. A stiffener(130) supports the substrate and the heat sink at an outer circumference of the semiconductor chip. |
