MAGNETIC SELF-ASSEMBLY FOR INTEGRATED CIRCUIT PACKAGES
摘要
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
申请公布号
CA2600611(C)
申请公布日期
2012.06.05
申请号
CA20062600611
申请日期
2006.02.28
申请人
SENSORMATIC ELECTRONICS CORPORATION
发明人
CLARK, JOHN J.;LIAN, MING-REN;SHAFER, GARY MARK;REYNOLDS, GEORGE ANTHONY, JR.