发明名称 |
Thermal data output circuit and multi chip package using the same |
摘要 |
A temperature data output circuit is provided which is capable of outputting a temperature signal which is enabled when an internal temperature of at least one of the semiconductor memory chips mounted on a multi chip package exceeds a predetermined temperature. |
申请公布号 |
US8192082(B2) |
申请公布日期 |
2012.06.05 |
申请号 |
US20080317218 |
申请日期 |
2008.12.18 |
申请人 |
SONG HO UK;CHU SHIN HO;HYNIX SEMICONDUCTOR INC. |
发明人 |
SONG HO UK;CHU SHIN HO |
分类号 |
G01K7/00 |
主分类号 |
G01K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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