发明名称 Substrate processing apparatus and substrate processing method
摘要 In the present invention, a holding table incorporating a heater is provided, for example, in a treatment container of a planarization unit. A pressing plate having a lower surface formed flat is disposed above the holding table. The pressing plate is movable in the vertical direction and can lower to the holding table to press a resist film on the substrate from above. The pressing plate intermittently presses the upper surface of the resist film to planarize the upper surface while the heater is heating the substrate on the holding table at a predetermined temperature to dry the resist film. According to the present invention, a coating film applied on the substrate can be sufficiently planarized and dried.
申请公布号 US8192796(B2) 申请公布日期 2012.06.05
申请号 US20100781867 申请日期 2010.05.18
申请人 SHINYA HIROSHI;TERADA SHOUICHI;MIZUNO TSUYOSHI;WAKAMOTO YUKIHIRO;TOKYO ELECTRON LIMITED 发明人 SHINYA HIROSHI;TERADA SHOUICHI;MIZUNO TSUYOSHI;WAKAMOTO YUKIHIRO
分类号 B05D3/12 主分类号 B05D3/12
代理机构 代理人
主权项
地址