| 摘要 |
PURPOSE: A substrate plating apparatus is provided to prevent excessive plating on the edges of a substrate because the central portion of a target unit protrudes higher than the outer portion thereof. CONSTITUTION: A substrate plating apparatus(100) comprises a process chamber(110), a cathode voltage application unit(150), and a target unit(120). The process chamber accommodates electrolyte(103), and a chuck(125) clamping a wafer(W) is arranged on the upper side of the process chamber and lifted. The cathode voltage application unit contacts the edges of the wafer and applies cathode voltage to the wafer when the wafer is lowered and dipped into the electrolyte. The target unit is installed on the inner bottom of the process chamber and generates plus metal ion when applied with anode voltage. The central portion of the target unit protruded higher than the outer portion thereof.
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