Photo-sensitivity resin composition, its Dielectric insulating film and Electronic device

摘要

PURPOSE: A photo-sensitive resin composition, an insulating film using the same, and electronic parts thereof are provided to improve permeability and contrast while the thickness of a thermosetting film is kept. CONSTITUTION: A photo-sensitive resin composition includes 100 parts by weight of a copolymer, 0.1-10 parts by weight of a photo-polymerization initiator containing the compound represented by chemical formula 1, 1-150 parts by weight of polymerizable ethylenically unsaturated monomer compounds, 0.5-30 parts by weight of functional silane compounds, and 1-20 parts by weight of one or more compounds selected from the compound represented by chemical formula 2, the compound represented by chemical formula 3, or a mixture of the compounds. The copolymer includes unsaturated carbonic acid, unsaturated carboxylic acid anhydride, or a mixture of the same, an aromatic unsaturated monomer, unsaturated compounds with epoxy groups or oxetane groups or a mixture of the same, and methyl methacrylate. The epoxy groups or oxetane groups are selected from glycidyl methacrylate, 4-hydroxybutyl acrylate triglycidyl ether, and 3-ethyl-3-methylmethacrylate oxetane.