| 发明名称 |
Adhesive layer composition for in-mold decoration |
| 摘要 |
This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material. |
| 申请公布号 |
US8192837(B2) |
申请公布日期 |
2012.06.05 |
| 申请号 |
US20080337478 |
申请日期 |
2008.12.17 |
| 申请人 |
WANG XIAOJIA;PERERIA CHERI;WANG PEI-LIN;CHEN JING-DEN;LIANG RONG-CHANG;ETANSI INC. |
发明人 |
WANG XIAOJIA;PERERIA CHERI;WANG PEI-LIN;CHEN JING-DEN;LIANG RONG-CHANG |
| 分类号 |
A01K1/015;B28B7/22;B28B7/36;B28B7/38;B29C33/56;B29C41/32;B29C45/14;B32B5/16;B32B7/12;B32B15/04;B41B11/54;B60C1/00;C04B28/14;C08F8/00;C08F8/30;C08F283/04;C08F290/04;C08G18/08;C08G63/48;C08G63/91;C08J3/02;C08K3/20;C08K3/26;C08K3/30;C08K3/34;C08K3/40;C08K9/00;C08K9/04;C08L51/00;C08L75/00;C08L83/00;C09B67/00;C09C1/42;C09D5/02;C09D17/00;C09K19/00 |
主分类号 |
A01K1/015 |
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