LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD FOR SEMICONDUCTOR CELLS

摘要

PURPOSE: A lead wire connection apparatus for semiconductor cells and a connection method thereof are provided to completely connect a lead wire to a semiconductor cell by preventing a thermosetting conductive member on which the lead wire is pre-pressed from being hardened by heat. CONSTITUTION: A string(1A) is connected in a row by a lead wire(2). A conductive tape(3) is made of a thermosetting resin having adhesive force. The string is carried by an endless belt(11). A main press bonding apparatus(12) includes a top driving element(16) having a board-shape and a lower driving element(18) driven by a lower cylinder. Three lower pressure tools(21) heated by a heater(21a) are installed on an upper side of the lower driving element.