SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to improve the yield of a semiconductor package by eliminating defects caused by a wire by preventing adjacent wires from being contacted. CONSTITUTION: A first lead frame(210) includes a first die paddle(212) and a first lead(214). A first semiconductor chip(220) is mounted on the first die paddle of a first lead frame. A first wire(230) electrically connects an upper side of the first semiconductor chip and first leads. A second lead frame(310) includes a second die paddle(312) and a second lead(314). A second semiconductor chip(320) is mounted on the second die paddle of a second lead frame. A second wire(330) electrically connects the upper side of the second semiconductor chip and second leads.