| 摘要 |
PURPOSE: A semiconductor chip package manufacturing method is provided to prevent generation of a void between a semiconductor chip and a substrate by supplying a resin by tilting the substrate in which a semiconductor is mounted. CONSTITUTION: A semiconductor chip(120) is mounted on a substrate(110). A dam(150) is formed on three surfaces excluding a single surface among the side surfaces of the mounted semiconductor chip. The dam prevents leakage of resin to the outside by being connected to each other. The substrate and the semiconductor chip are tilted with a predetermined angle. The resin is supplied between the semiconductor chip and the substrate through an opened region of the dam.
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